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多芯片封装组件MCM由于其高度集成性使得近年来在电子设备整机高速化、多功能化和小型化发展中得到了广泛应用,但MCM因工作生热导致的内部热应力及应力集中问题已经成为影响电路可靠性的关键因素。通过实验方法只能获得MCM封装实体外部的温度,而内部的温度场和应力应变情况只能通过计算机仿真技术来得到。文章利用有限元分析软件ANSYS对基于君正4770处理器的主控模块MCM组件设计进行了温度场和热应力应变分析,并且通过优化设计提高了组件设计的可靠性。
Due to its high degree of integration, multi-chip package MCM has been widely used in recent years in the high-speed, multi-functional and miniaturization of electronic equipment. However, the internal thermal stress and stress concentration problems caused by MCM due to work heat have been Become a key factor affecting circuit reliability. Only the temperature outside the MCM package can be obtained by experimental method, while the internal temperature field and stress-strain can only be obtained by computer simulation. In this paper, the finite element analysis software ANSYS is used to analyze the temperature field and thermal stress strain of the MCM module based on the Junsen 4770 processor, and the reliability of the component design is improved through the optimized design.