论文部分内容阅读
本文采用真空熔炼及定向凝固工艺研制了Cu-Te-Se系真空断路器触头材料,研究了化学成分和触头直径对开断能力的影响,讨论了影响Cu-Te-Se合金开断能力的其它因素。并从Boxman的多阴极斑点模型出发,建立了化学成分与临界电流密度之间的关系。计算结果表明,在电流密度均匀分布的情况下,铜的临界电流密度为3×10~7A/m~2。最后通过扫描电镜分析了大电流燃弧后触头表面的烧蚀形貌特征。
In this paper, the contact material of Cu-Te-Se vacuum circuit breaker was developed by vacuum melting and directional solidification process. The influence of chemical composition and contact diameter on the breaking capacity was studied. The influence of Cu-Te-Se alloy on breaking capacity Other factors. Based on Boxman’s multi-cathode speckle model, the relationship between chemical composition and critical current density was established. The calculation results show that the critical current density of copper is 3 × 10 ~ 7A / m ~ 2 under the uniform current density distribution. Finally, the morphology of the ablation surface of the contact surface after heavy current arc was analyzed by SEM.