印制电路行业高密度互连(HDI)技术提出始于上世纪1990年代,在PCB种类中新增了一种HDI板。HDI技术和HDI板在日本又称积层(Build Up)多层板技术和积层板(Build-Up Board),在美国又称微导通孔(Microvia)技术和微导通孔板(Microvia Board)。HDI板的应用从手机、数码相机、IC封裝扩大到 Printed Circuits Industry High-density interconnect (HDI) technology began in the 1990s with the addition of an HDI board to the PCB category. HDI technology and HDI board are also called Build Up multilayer board technology and Build-Up Board in Japan. In the United States, Microvia technology and Microvia Board). HDI board applications from cell phones, digital cameras, IC package expanded to