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近年来 ,由于半导体制造技术不断向微细化、高速、高密度方向发展 ,适用于平坦化工艺的ＣＭＰ技术得以飞速发展 ,ＣＭＰ设备市场从 1 994年初具规模到目前迅速地增大。其推进情况如下 :1 994年 6 0 0 0亿日元 ;1 995年 1 5 0 0 0亿日元 ;1 996年 40 0 0 0亿日元 ;1 997年 6 5 0
In recent years, as the semiconductor manufacturing technology continues to be miniaturized, high-speed and high-density, the CMP technology applied to the planarization process has been rapidly developed. The CMP equipment market has rapidly expanded from the beginning of 1994 to the present. The progress is as follows: 160 billion yen in 1994; 150 billion yen in 1995; 400 billion yen in 1996; 657 million in 1997