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CCD键合工艺要求硅铝丝依次在Au焊盘和Al焊盘上完成一、二焊的超声键合。文章分别以Au焊盘和Al焊盘为研究对象,通过调整键合中的超声功率和线弧高度参数,在超声功率为20%～50%、线弧高度为1 000～1 800μm范围内,设定48组不同的实验条件进行键合,以键合后拉力测试结果为表征量,采用工序能力指数(Cpk)的统计方法进行归纳比较,从中选取最优实验参数用于大面阵CCD键合工艺,以达到优化键合参数的目的。
The CCD bonding process requires the silicon aluminum wire to be sequentially completed with one or two-wire ultrasonic bonding on the Au pad and the Al pad. In this paper, the Au pad and the Al pad are taken as the research objects respectively. By adjusting the ultrasonic power and the height of the arc in the bond, the ultrasonic power is 20% ~ 50%, the height of the arc is 1000 ~ 1800μm, 48 groups of different experimental conditions were set for bonding, and the post-bonding tensile test results were used as the characterization quantities. The statistical methods of process capability index (Cpk) were used for induction comparison. The optimal experimental parameters were selected for the large-area CCD Combined process, in order to achieve the purpose of optimizing the bonding parameters.