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以硼酸作为高羟甲基低游离酚PF(酚醛树脂)的改性剂,制备相应的BPF(硼改性酚醛树脂)及其模塑料。采用红外光谱(FT-IR)法对BPF的结构进行了表征,并对其凝胶化时间、固化工艺条件、热性能和模塑料的性能等进行了探讨。研究结果表明:当w(B)=9%时,BPF及其模塑料的综合性能相对最好,其固化工艺为160℃/20 min,后处理工艺为“140℃/1 h→160℃/1 h→180℃/2 h”;与纯PF模塑料相比,BPF模塑料的马丁耐热温度(196℃)提高了42℃、弯曲强度(111.8 MPa)提高了21.9 MPa且冲击强度(18.50 kJ/m2)也有所提高。
Boric acid is used as a modifier of the high-methylol low free phenol PF (phenolic resin) to prepare the corresponding BPF (boron-modified phenolic resin) and its molding compound. The structure of BPF was characterized by FT-IR, and the gelation time, curing process conditions, thermal properties and the properties of the molding compound were discussed. The results show that when w (B) = 9%, the comprehensive properties of BPF and its molding compound are the best, the curing process is 160 ℃ / 20 min and the post-treatment process is “140 ℃ / 1 h → 160 ℃ / 1 h → 180 ° C / 2 h ”. Compared with the pure PF molding compound, the heat-resistant temperature (196 ℃) of the molded BPF material increased by 42 ℃, the bending strength (111.8 MPa) increased by 21.9 MPa and the impact strength (18.50 kJ / m2) also improved.