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采用化学发泡模压成型制备环氧树脂基发泡材料,以不同成型温度下环氧树脂基发泡材料的表观密度、泡孔平均直径、泡孔尺寸分布、泡孔密度的统计和SEM观察,考察成型温度对化学发泡制备环氧树脂基发泡材料发泡行为的影响。结果表明:在一定温度下环氧树脂固化速率与发泡剂的分解速率相当时,环氧树脂固化与泡孔形核、长大、定型的同步协调性较好,实验范围内,当成型温度为160℃,可获得泡孔尺寸为78μm、泡孔密度为1.23×106个/cm3、泡孔尺寸分布均匀的微孔发泡环氧树脂基材料。
Epoxy resin-based foams were prepared by chemical foaming molding. The apparent density, average cell diameter, cell size distribution, cell density statistics and SEM observation of epoxy resin-based foams at different molding temperatures , The impact of molding temperature on the foaming behavior of epoxy resin-based foams prepared by chemical foaming was investigated. The results show that the epoxy resin curing rate at a certain temperature is comparable with the decomposition rate of the foaming agent. The simultaneous curing of the epoxy resin and the nucleation, growth and shape of the cells is better. In the experimental range, when the molding temperature Is 160 ° C., a microporous foaming epoxy resin-based material with a cell size of 78 μm, a cell density of 1.23 × 10 6 cells / cm 3 and a uniform cell size distribution can be obtained.