Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser

来源 :半导体学报:英文版 | 被引量 : 0次 | 上传用户：kim12344

【摘要】

：

Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were

【作者】

：

Hao Lin Deyao Li Liqun Zhang P

【机构】

：

SchoolofMaterialsScienceandEngineering,SuzhouInstituteofNano-TechandNano-Bionics

【出处】

：

半导体学报:英文版

【发表日期】

：

2020年10期

【关键词】

：

Au80Sn20 laser diodes package thermal resistance

【基金项目】

：

supported by the National Key Research and Development Program of China(Grant Nos.2016YFB0401803,2017YFE0131500,2017YFB0405000),National Natural Science Foundation of China(Grant Nos.61834008,61574160

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Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then invest

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Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser

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