高功率板条放大器冷却系统模拟及优化设计

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基于传导冷却端面抽运板条激光放大器结构,设计矩形槽微通道水冷热沉作为放大器冷却系统,借助有限元分析(FEA),对微通道热沉尺寸进行了优化,得出槽宽占空比为0.57时热沉冷却性能最好。结合分析结果,设计一槽宽0.4 mm,肋宽0.35 mm的微通道热沉进行实验验证,将实验与模拟结果进行对比拟合得到热沉传热系数与水流速的关系曲线。进一步模拟了激光板条在热沉作用下温度分布情况,得到在水流速很低的情况下板条冷却面具有很小热阻的结果。 Based on the structure of conduction-cooled end-pumped lath laser amplifier, a rectangular slot microchannel water-cooled heat sink is designed as an amplifier cooling system. With the aid of finite element analysis (FEA), the microchannel heat sink size is optimized, Heat sink cooling ratio of 0.57 best performance. According to the results of the analysis, a microchannel heat sink with a slot width of 0.4 mm and a rib width of 0.35 mm was designed and validated. The relationship between the heat transfer coefficient of the heat sink and the water flow rate was obtained by comparing the experimental results with the simulation results. The temperature distribution of the laser slab under the action of the heat sink is further simulated, and the result that the slab cooling surface has a very small thermal resistance under the condition of a low water flow velocity is obtained.
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