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报道了一种基于CMOS工艺接收电路芯片和GaAs工艺1×12光电探测器阵列的30Gbit/s并行光接收模块.该模块采用并行光通信方案,利用中高速光电子器件实现信号的高速传输.直接使用未经封装的接收电路裸片和光探测器裸片,采用电路板上芯片技术封装制作模块,并通过倒装焊的方式实现了探测器阵列与列阵光纤的精确对准并形成了可插拔的光接口.测试结果表明模块的接收能力可以达到30Gbit/s.误码率小于10-13时,接收模块的灵敏度可以达到-13.6dBm.
A 30Gbit / s parallel optical receiver module based on CMOS technology receiving circuit chip and GaAs process 1 × 12 photodetector array is reported.The module uses parallel optical communication scheme and utilizes high-speed optoelectronic devices for high-speed signal transmission. Unpackaged receiving circuit die and photodetector die, the use of circuit board chip technology package making module, and by flip-chip way to achieve the detector array and array fiber accurate alignment and the formation of the pluggable Of the optical interface.The test results show that the module’s receiving capacity can reach 30Gbit / s bit error rate of less than 10-13, the receiving module sensitivity can reach -13.6dBm.