系统应用

来源 :网友世界 | 被引量 : 0次 | 上传用户:abcd432110000
下载到本地 , 更方便阅读
声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架
论文部分内容阅读
00633 多芯片组件在军事领域的应用状况及市场动态/赵钰(中国电子科技集团公司第43研究所)//混合微电子技术。—2003,1—2.—14 先进微电子和光电子是信息时代信息高速公路的基本建设单元,多芯片组件(MCM)是为满足高速传输网络通信数据和便携式通信装置需求的关键封装技术。该技术具有集成度高、体积小、重量轻、性能可靠,功率耗散小,可靠性高及节省成本的优越性。本文通过 00633 Multi-chip components in the military applications and market dynamics / Zhao Yu (China Electronics Technology Group 43 Institute) // hybrid microelectronics. -2003, 1-2.-14 Advanced Microelectronics and Optoelectronics are the basic building blocks of the Information Age Information Highway. Multi-chip components (MCMs) are key packaging technologies that address the needs of high-speed transport network communications data and portable communications devices. The technology has the advantages of high integration, small size, light weight, reliable performance, small power dissipation, high reliability and cost savings. This article is adopted
其他文献