我国半导体封装业相比IC设计和制造最接近国际先进水平,先进封装技术的广泛应用将改变半导体产业竞争格局,我国半导体封装业在“天时、地利、人和”有利环境下有望在国际竞争中实现“弯道超车”。半导体封装地位提升随着摩尔定律的不断微缩化以及12英寸替代8英寸晶圆成为制程主流,单位芯片制造成本呈现同比快速下降走势。而对于芯片封装环节,随着芯片复杂度的提高、封装原材料尤其是金丝价格的上扬以及封装方式由低阶向高阶的逐 China’s semiconductor packaging industry compared to the IC design and manufacture of the most advanced international advanced level, the extensive application of advanced packaging technology will change the competitive landscape of the semiconductor industry, China’s semiconductor packaging industry in the “weather, geography, people and” favorable environment is expected in the international Competition to achieve “corner overtaking ”. Improve the status of semiconductor packaging With the continuous miniaturization of Moore’s Law and the 12-inch alternative 8-inch wafer become the mainstream of the process, unit manufacturing costs showed a year-on-year rapid decline. As for the chip packaging, with the increase of chip complexity, packaging materials, especially the rising price of gold wire and packaging from low to high order