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被誉为中国版“工业4.0”的《中国制造2025》规划终于浮出水面,国家层面部署全面推进实施制造强国战略,聚焦制造业绿色升级、智能制造、高端装备创新三大方向,并提出到2025年迈入制造强国行列。在召开的第十三届中国国际半导体博览会暨高峰论坛(IC China 2015)新闻发布上,中国半导体行业协会执行副理事长兼秘书长徐小田、中国电子器材总公司常务副总经理陈雯海,上海市集成电路行业协会秘书长蒋守雷等出席,活动同期主办方邀请国内外近百位产业嘉宾及行业媒体参与本次活动,且众多半导体产业走势数据及2015展会热点于本次发布会中首次披露。
The “Made in China 2025” Plan, honored as the Chinese version of “Industry 4.0”, has finally surfaced. The deployment at the national level has promoted the implementation of the strategy of building a strong nation in an all-round way and focused on the three major directions of manufacturing green upgrade, smart manufacturing and high-end equipment innovation Proposed by 2025 to enter the ranks of manufacturing power. At the 13th China International Semiconductor Expo and Summit (IC China 2015) press release, Xu Xiaotian, executive vice president and secretary general of China Semiconductor Industry Association, Chen Wenhai, executive vice president of China Electronics Equipment Corporation, Secretary General of IC Industry Jiang Shurei attended the event. During the same period, the organizers invited nearly 100 domestic and foreign industry guests and industry media to participate in the event. Many semiconductor industry trends and hot topics in 2015 were first disclosed in this conference.