用优良的绝缘材料聚酰亚胺制得了稳定的 LB 膜,介电和 C-V 特性测量表明它具有良好的绝缘性能,热稳定温度高达340℃以上,远远高于传统的长链脂肪酸,缺陷密度也远低于传统的二氧化硅膜,这使它有可能被应用于微电子工业之中。 The LB film was prepared by using polyimide, which is an excellent insulating material. The dielectric and CV properties measurements showed that it has good insulation properties. The thermal stability temperature is up to 340 ℃, which is much higher than the traditional long chain fatty acids. The defect density Also far below the traditional silicon dioxide film, which makes it possible to be used in the microelectronics industry.