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热致形状记忆高分子(TSMP)材料是指在一定温度下变形并能在室温固定大部分形变且长期存放,当再升温至某一特定温度时,制件能很快回复到变形前形状的一种重要的新型功能材料。由于其采用温度控制、方法简单、加工容易,近年来得到了很大发展并日益引起了人们的广泛关注,现已广泛应用于电子通讯、医疗器械、机械制造、日常用品及农业能源等领域。主要综述了热致形状记忆高分子材料的机理、表征和制备方法,并进一步评述了最近的一些研究现状、应用前景以及发展趋势。
Thermo-induced shape memory polymer (TSMP) material refers to the deformation at a certain temperature and can be fixed at room temperature most of the deformation and long-term storage, when warmed to a specific temperature, the workpiece can quickly return to the pre-deformation shape An important new functional material. Because of its temperature control, the method is simple and the processing is easy. In recent years, it has been greatly developed and aroused widespread concern. It has been widely used in the field of electronic communication, medical equipment, machinery manufacturing, daily necessities and agricultural energy. The mechanism, characterization and preparation of thermosensitive shape memory polymer materials are reviewed. Some recent research status, application prospects and development trends are also reviewed.