多芯式组件（ＭＣＭ）以及其它高功率密度器件的热分析和热设计技术，是微电子设备可靠性设计的主要技术。文中论述了多芯片组件热分析和热设计的方法，并介绍了这一领域的最新发展动态 Thermal analysis and thermal design techniques for multi-core modules (MCMs) and other high-power-density devices are key technologies in the reliability design of microelectronic devices. This article discusses the thermal analysis of multi-chip components and thermal design methods, and introduced the latest developments in this area