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讨论了近室温工作的HgCdTe中波光导探测器组件的可靠性问题,包括组件封装失效、引线键合失效和探测器的性能衰减等。通过收集探测器组件的失效信息,对其失效物理化学机制、制造工艺和探测器参数进行了分析,建立了组件的故障树(FTA),为探测器组件的失效分析提供了理论依据。由FTA定性分析得出探测器组件FTA的最小割集;计算了顶事件的失效几率。通过计算底事件概率重要度,得出组件封装失效是探测器组件失效的主要故障途径;同时实验发现,失效组件探测器的少子寿命值有较大的衰减,这可能起源于失效探测器的表面钝化层退化。
The reliability of the HgCdTe MWW detector assembly working near room temperature is discussed, including component package failure, wirebond failure and detector performance degradation. By collecting the failure information of detector components, the physical and chemical mechanism of failure, manufacturing process and detector parameters are analyzed, and the fault tree (FTA) of the components is established, which provides a theoretical basis for the failure analysis of detector components. The minimum cut set of detector component FTA was obtained by FTA qualitative analysis. The probability of failure of the top event was calculated. By calculating the importance of the probability of the bottom event, it is concluded that the failure of the component package is the main failure path of the detector component. At the same time, it is found that the lifetime of the missing component detector has a larger attenuation, which may originate from the surface of the failure detector Passivation layer degradation.