凝固过程中金属和铸型界面间隙及其换热条件的研究

来源 :铸造 | 被引量 : 0次 | 上传用户:yangzanJane
下载到本地 , 更方便阅读
声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架
论文部分内容阅读
本文通过测量温度和金属与铸型间的间隙来研究凝固过程中金属与铸型界面传热行为及气隙形成规律。实验表明:由凝固过程中金属和铸型产生的收缩或膨胀是产生界面气隙的主要原因。在凝固初期,气隙的形成主要是铸型受热膨胀向外移动所致,而随后铸件凝固产生的收缩造成了金属与铸型间气隙的扩大。气除形成后,界面传热由固体接触导热转为气体导热和辐射传热。界面换热系数约为气体导热系数和辐射传热系数之和。 In this paper, the temperature and the gap between the metal and the mold were investigated to study the heat transfer behavior and the air gap formation between the metal and the mold during the solidification process. Experiments show that the shrinkage or expansion caused by the metal and mold during the solidification process is the main reason for the interface air gap. In the initial stage of solidification, the formation of the air gap is mainly caused by outward expansion of the mold due to thermal expansion, and then the shrinkage of the solidification of the casting causes the expansion of the air gap between the metal and the mold. After the formation of gas, the interface heat transfer from the solid contact heat transfer to gas heat and radiation heat transfer. The interface heat transfer coefficient is approximately the sum of the gas thermal conductivity and the radiative heat transfer coefficient.
其他文献
使用渗流网格建模无线电波的随机传播环境,在此基础上使用随机射线方法,从概率论的角度得到若干路径损耗的解析公式。经过与经典路径损耗模型以及其他由非波动方法得到的路径