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采用Ｂｏｄｎｅｒ－Ｐａｒｔｏｍ粘塑性本构理论研究了Ｓｎ－Ｐｂ共晶合金的本构方程。在应变速率１０－５—１０－２Ｓ－１、温度为－５５—１２５℃的外部变量范围内进行了单轴拉伸和稳态蠕变数值模拟，结果与实验吻合良好。同时讨论了该本构方程用于ＳＭＴ焊点热循环寿命预测的实际意义。
The constitutive equation of Sn-Pb eutectic alloy was studied by Bodner-Partom visco-plastic constitutive theory. The uniaxial tension and steady-state creep numerical simulation were carried out within the range of external variables of strain rate 10-5-10-2S-1 and temperature of -55-125 ℃. The results agree well with the experimental results. The practical significance of this constitutive equation for predicting the thermal cycle life of SMT solder joints is also discussed.