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通过在不同的磁控溅射阴极靶电源供给模式下制备纯Ti薄膜,并采用扫描电镜、X射线衍射、纳米压痕仪及微划痕试验等表征方法对比研究了阴极靶在不同电场模式下对Ti薄膜微观结构、相组成、显微硬度及膜基结合强度的影响。结果表明:相对于直流电场和高功率脉冲电场,通过双脉冲电场模式所制备的纯Ti薄膜具有纳米多晶结构,其晶粒尺寸为17 nm,组织致密,硬度和弹性模量分别达到了3.5 GPa和123 GPa,并且显著提高了与膜基的结合强度。
Pure Ti thin films were prepared by different magnetron sputtering cathode target power supply modes. The scanning electron microscopy, X-ray diffraction, nanoindentation and micro-scratches were used to characterize the cathode targets in different electric field modes On Ti film microstructure, phase composition, microhardness and film-based bonding strength. The results show that the pure Ti thin films prepared by the double pulse electric field mode have a nano-polycrystalline structure with a grain size of 17 nm and dense microstructure with a hardness and elastic modulus of 3.5 GPa and 123 GPa, and significantly increased the bonding strength to the film base.