论文部分内容阅读
提出了采用双电场对硅 /玻璃进行阳极键合的方法 .采用这种方法 ,能够有效地避免和减少键合过程中的静电力对 MEMS器件的可动敏感部件的损伤和破坏 ,同时实验结果也验证了该方法 .
A method of anodic bonding between silicon and glass using a double electric field is proposed.The method can effectively avoid and reduce the damage and destruction of the movable sensitive components of the MEMS device by the electrostatic force in the bonding process, Also verified this method.