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SMO-8陶瓷管壳封装的器件在焊接到印制板作温度冲击试验后,管壳底部的陶瓷层出现了裂纹。使用ANSYS有限元分析的方法对管壳焊接到印制板的整体结构的应力分布情况进行仿真分析,找出陶瓷出现裂纹的力学原因。并据此提出SMO-8陶瓷管壳焊接的改进方案:SMO-8管壳接地焊盘由方形设计改为边缘圆弧形设计,然后重新做应力分析。通过对比,在相同温度条件下管壳陶瓷层所受应力分布改善,边沿所受应力值明显降低。根据仿真结果制作样品并对样品做温度冲击试验进行验证。结果表明,圆弧形焊盘设计可以解决SMO-8封装器件焊接后经温度冲击时出现的陶瓷层裂纹问题。
SMO-8 ceramic tube package device after welding to the PCB for temperature impact test, the bottom of the ceramic tube layer cracks. The finite element analysis of the finite element method is used to simulate the stress distribution of the shell welded to the printed circuit board so as to find out the mechanical causes of the ceramic cracks. Based on this, the improvement of SMO-8 ceramic shell welding is proposed: SMO-8 shell shell grounding pad is changed from square design to edge circular arc design, and then stress analysis is done again. By comparison, under the same temperature conditions, the stress distribution of the ceramic shell of the shell tube is improved, and the stress value on the edge is obviously reduced. According to the simulation results of the production of samples and samples to do temperature impact test to verify. The results show that the arc-shaped pad design can solve the problem of ceramic layer cracks when the SMO-8 package is subjected to temperature impact after soldering.