低熔点金属/聚合物复合材料的研究现状

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聚合物基导电复合材料在电磁屏蔽、导电、抗静电、自限温加热、甚至导热等领域,具有广泛的用途。这类复合材料中所用的填料主要有金属、炭黑、石墨、石墨烯等。这些填料在加工过程中处于固态。与之不同的是,低熔点金属熔点低,在加工过程中处于液态,从而可以降低复合体系粘度、提高加工性能、降低设备磨损;还可以实现加工过程中填料原位细化和原位纤维化,以及形成双连续相结构。本文概述了低熔点金属填充聚合物复合材料的制备方法,以及复合材料结构、导电性、流变性和力学性能的主要特点,分析了与其它聚合物基导电复合材料相比LMPM/聚合物复合材料的优势,指出了该领域需要进一步研究的方向。 Polymer-based conductive composite materials in the electromagnetic shielding, conductive, antistatic, self-limiting heating, and even thermal conductivity and other fields, has a wide range of uses. Such composite materials used in the main filler metal, carbon black, graphite, graphene and so on. These fillers are in a solid state during processing. In contrast, low melting point metal melting point is low, in the process of liquid, which can reduce the viscosity of the composite system to improve processing performance and reduce equipment wear and tear; processing can also be achieved in situ filler refinement and in situ fibrosis , And form a bicontinuous phase structure. In this paper, the preparation methods of low-melting-point metal-filled polymer composites and the main features of the structure, conductivity, rheology and mechanical properties of the composites are summarized. Compared with other polymer-based conductive composites, the LMPM / polymer composites The advantages of this area, pointed out that the field needs further research direction.
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