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采用镁合金表面预镀镍工艺,用其代替氰化物电沉积铜。分析镁合金预处理技术、氟化物处理、化学浸锌、电镀铜锡、预镀镍溶液成分及工艺条件对沉积层的影响,并比较各种工艺参数对铜锡合金层、镍层晶粒尺寸的作用。利用扫描电镜观察各镀层的表面形貌、XRD分析处理层的相组成,用极化曲线分析镀层的腐蚀倾向。结果表明:在此工艺条件下,较为有效地解决了镁合金电镀过程中因与镍电位差过大、易腐蚀不易沉积的问题;可以在镁及镁合金表面形成致密度高、孔隙率低、结合强度好且硬度高的合金镀层。
Magnesium alloy surface pre-nickel plating process, instead of cyanide electrodeposition of copper. The effects of magnesium alloy pretreatment technology, fluoride treatment, chemical zinc immersion, copper electroplating tin, pre-nickel plating solution composition and process conditions on the deposited layer were analyzed. The effects of various process parameters on the grain size of Cu-Sn alloy layer, Role. The surface morphology of each coating was observed by scanning electron microscopy. The phase composition of the treated layer was analyzed by XRD, and the corrosion tendency of the coating was analyzed by polarization curves. The results show that under the conditions of this process, the problem that the potential difference between the magnesium alloy and the nickel is too large and the easy corrosion is difficult to deposit is solved effectively. The magnesium alloy can be formed on the magnesium and magnesium alloy surfaces with high density, low porosity, Combination of strength and high hardness of the alloy coating.