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研究了器件端头两种不同的金属化层（Ａｎ－Ｐｄ和 Ｎｉ／Ａｎ－Ｐｄ）对 Ｓｎ－Ｓｂ钎料表面贴装焊点的形状、微结构及剪切强度的影响，并与常用的 Ｓｎ－Ｐｂ－Ａｇ钎料焊点进行了比较结果表明。 Ｓｎ－Ｓｂ／Ａｇ－Ｐｄ焊点由于 Ｓｎ－Ｓｂ钎料与 Ａｇ－Ｐｄ层在回流焊接过程中的剧烈反应导致钎料在器件端头区域集中而不在 Ｃｕ焊盘上充分铺展，焊点强度低，断裂发生在原 Ａｇ－Ｐｄ／陶瓷界面；Ｓｎ－Ｓｂ／Ｎｉ／Ａｇ－Ｐｄ焊点中 Ｎｉ有效地阻止了 Ａｇ－Ｐｄ在钎料中的溶解，焊点形状理想，强度很高；而对于Ｓｎ－Ｐｈ－Ａｇ饵料，器件金属化层对焊点形状和强度影响不大，剪切测试后，断裂发生在钎料内部．
The effects of two different metallization layers (An-Pd and Ni / An-Pd) on the shape, microstructure and shear strength of Sn-Sb solder surface mount solder joints were investigated. Sn-Pb-Ag solder solder joints were compared results show. Sn-Sb / Ag-Pd Solder Joints Due to the violent reaction of Sn-Sb solder and Ag-Pd layers during reflow soldering, the solder is concentrated in the tip area of the device without fully spreading on the Cu pad. The solder joint strength is low , The rupture occurred in the original Ag-Pd / ceramic interface; Ni in Sn-Sb / Ni / Ag-Pd solder joints effectively prevented the dissolution of Ag-Pd in solder and the shape of solder joint was ideal and the strength was high; -Ph-Ag bait, the device metallization layer has little effect on the shape and strength of the solder joint. After the shear test, the rupture occurred inside the solder.