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普通的光学显微镜是用光源照射样品,观察反射光或透射光并成像。与普通显微镜不同,红外热像仪和光辐射显微镜是用于检测样品本身发出的光辐射并成像,前者在红外光范围,后者在可见光范围,它们都是电子元器件失效分析的重要工具。1 显微红外热像仪InfraScope微电子器件正向着大功率、高频和高集成度(小元件尺寸)的方向发展。器件在工作过程中由于局部的缺陷会引起非正常的局部发热升温,这是影响器件可靠性的重要因素。测定器件管芯的热分布结温和热点是器件可靠性设计、可靠性评价和失效分析的重要环节。与其它接触式测温方法相比,红外热像法是一种非接触的测温技术。测量过程中不会改变被测器件的热状态,因而测量精
Ordinary optical microscope is the light source sample, observe the reflected light or transmitted light and imaging. Unlike ordinary microscopes, thermal imaging cameras and light-emitting microscopes are used to detect and image the light radiation emitted by the sample itself, the former in the infrared range and the latter in the visible range, all of which are important tools for the failure analysis of electronic components. 1 Microscopy InfraScope microelectronics are moving in the direction of high power, high frequency and high integration (small component size). Device in the process of working due to local defects can cause abnormal local heating temperature, which is an important factor affecting the reliability of the device. Measuring the thermal distribution of the device die junction temperature and hot spot is an important part of device reliability design, reliability evaluation and failure analysis. Compared with other contact temperature measurement method, infrared thermography is a non-contact temperature measurement technology. Measurement process will not change the thermal state of the device under test, thus measuring precision