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利用XRD研究了电刷镀Ni-P镀层经不同温度热处理后的组织结构.研究表明,镀态电刷镀Ni-P镀层呈非晶态;热处理温度在350℃以上时,Ni,Ni3P形核生长;热处理温度在500℃以上时,镀层中有NiO生成.镀层的结晶度与热处理温度呈典型的“S”形关系变化,晶化激活能为(237.9±10.46)kJ·mol~(-1).随热处理温度升高,Ni的晶格常数先增大后减小;而Ni_3P的晶格常数a随热处理温度上升而变小,而c略微增大;Ni和Ni_3P晶粒大小随热处理温度的上升均增大;Ni和Ni_3P晶体长大的表观活化能分别为(66.85±3.15)kJ·mol~(-1)和(133.41±4.69)kJ·mol~(-1),前者仅为后者的50%,表明在热处理过程中Ni晶体有优先长大的趋势.
The microstructure of Ni-P coating was studied by X-ray diffraction (XRD) .It was found that Ni-P coating was electroplated by brush electroplating. When the temperature was above 350 ℃, Ni and Ni3P nucleation And the NiO layer was formed when the temperature was above 500 ℃ .The crystallinity and heat treatment temperature of the coating showed a typical change of “S” shape, the activation energy of crystallization was (237.9 ± 10.46) kJ · mol ~ ( -1). With the increase of heat treatment temperature, the lattice constant of Ni first increases and then decreases, while the lattice constant a of Ni_3P decreases with the increase of heat treatment temperature, while c increases slightly. The grain sizes of Ni and Ni_3P The apparent activation energy of growing Ni and Ni_3P crystals were (66.85 ± 3.15) kJ · mol -1 and (133.41 ± 4.69) kJ · mol -1, respectively. The former Only 50% of the latter, indicating that Ni crystals tend to grow preferentially during heat treatment.