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本文从理论上阐述了电子元器件塑料封装中存在的最关键的问题——防潮性和温循开裂,提出了解决途径;通过对塑料封装近几年来在国内外实际应用发展的讨论提出,采用透湿系数低和玻璃化转变温度高的高度交联有机高分子聚合物和采用合适的工艺是国外七十年代中后期塑料封装在电子元器件上应用得到迅速发展的关键。
In this paper, the most important problems in plastic packaging of electronic components are expounded in theory - moisture resistance and temperature cycling cracking, and the solutions are put forward. Based on the discussion of the practical application of plastic packaging in recent years at home and abroad, High cross-linked organic macromolecule polymers with low moisture permeability coefficient and high glass transition temperature and the adoption of appropriate process are the key to the rapid development of plastic packaging applied to electronic components in the late 1970s.