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目的 :探讨半导体激光在鼓室成形术中的应用。方法 :在鼓室成形术中运用激光处理听骨链或其周围病灶 14耳 ,术中激光操作主要用于锤砧骨与上鼓室骨性融合、听骨链周围的纤维瘢痕组织及切除锤骨头等。结果 :患者术后无眩晕、面瘫等并发症发生。术后听力提高平均为 2 4d B,气骨导差在 2 0 d B以内者 7耳 ( 5 0 % )。结论 :半导体激光在鼓室成形术中应用能有效减少对听骨链的触动 ,减少术野出血 ,尤其对处理听骨链与鼓室壁的骨性粘连有独特的优点
Objective: To investigate the application of semiconductor laser in tympanoplasty. METHODS: 14 cases of ossicular chain or its surrounding lesions were treated with laser in tympanoplasty. Laser operation was mainly used for the bony fusion of hammer anvil and upper tympanic cavity, fibrous scar tissue around the ossicular chain and resection hammerhead . Results: No postoperative vertigo, facial paralysis and other complications occurred. The average hearing improvement was 24 days after surgery, and 7 ears (20%) had less than 20 days of osteosynthesis. Conclusion: The application of semiconductor laser in tympanoplasty can effectively reduce the contact with the ossicular chain and reduce the surgical field bleeding, especially for the treatment of ossicular chain and tympanic wall bone adhesion has unique advantages