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掩模套准测量系统用来鉴定将要出厂的掩模版的质量,以确保使用者的技术要求。掩模检测程序和合格/不合格的条件通常都已定好,一般情况下,应从以下几方面考虑版的验收方案:1.掩模图形位置误差及对片子成品率的影响;2.掩模的技术条件及对掩模成本和制造周期的影响;3.每张掩模版或初缩版上芯片图形的数目;4.每套掩模曝光处理硅片的数目;5.采样图形及代表整张掩模上图形总位置误差的采样图形精度;6.在作出合格/不合格决定时可接受的冒险程度。
Mask registration measurement system used to identify the quality of the reticle to be shipped to ensure that the user’s technical requirements. Mask inspection procedures and pass / fail conditions are generally well defined. In general, the acceptance scenarios should be considered in the following ways: 1. The mask pattern position error and the effect on the wafer yield; 2. The mask’s The technical conditions and the impact on the mask cost and the manufacturing cycle; 3. the number of chip patterns on each reticle or primary plate; 4. the number of wafers exposed per mask; Mask pattern accuracy of the total graphic position error of the sample; 6. Acceptable degree of risk in making a pass / fail decision.