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采用内氧化工艺和粉末冶金制备了不同体积分数和不同增强相的Cu基复合材料,测试了Cu基复合材料的导电性能。结果表明,内氧化工艺制备的Al2O3/Cu复合材料的电导率和密度均高于粉末冶金工艺制备的Al2O3/Cu复合材料,且复合材料的电导率和密度随Al2O3颗粒增强相含量的增加而降低;另外,Cu基复合材料的电导率随颗粒-基体的热膨胀系数差值的增大而降低。微观组织观察表明,界面结合状态与复合材料的电导率密切相关。内氧化法制备的Al2O3/Cu复合材料比粉末冶金法制备的Al2O3/Cu复合材料晶界排列更整齐致密。
The Cu-based composites with different volume fractions and different reinforcing phases were prepared by internal oxidation process and powder metallurgy. The electrical conductivity of Cu-based composites was tested. The results show that the electrical conductivity and density of the Al2O3 / Cu composites prepared by the internal oxidation process are higher than that of the Al2O3 / Cu composites prepared by powder metallurgy process, and the electrical conductivity and density of the composites decrease with the increasing of Al2O3 particles content In addition, the conductivity of Cu-based composites decreases with the increase of the difference of thermal expansion coefficient between particles and matrix. Microstructure observation shows that the interface bonding state is closely related to the conductivity of the composite. Al2O3 / Cu composites prepared by the internal oxidation method are more orderly and compact than the grain boundaries of Al2O3 / Cu composites prepared by powder metallurgy.