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12月28日,由科通芯城发起,Intel、微软,小米、奇虎360、京东、比亚迪、3W、北京创客空间、点名时间、君联资本、磐谷资本、Xilinx、Atmel、网易科技、商业价值、易观网等10余家涵盖电子制造业、互联网、投资、媒体的明星机构联袂打造的“硬蛋?i未来硬件大赛”在北京正式启动,并正式面向全国征集硬件创新项目。启动仪式上,参会嘉宾从产业链角度,分析了硬件创新的突破口和未来机遇。主办方科通芯城执行副总裁朱继志在启动会致辞中表示,中国在硬件制造业有很强的领先
December 28, launched by Cogobuy, Intel, Microsoft, Xiaomi, Qihoo 360, Jingdong, BYD, 3W, Beijing Creator Space, named time, Junlian Capital, Pan Valley Capital, Xilinx, Atmel, , Commercial value, easy view of more than 10 covers electronic manufacturing, Internet, investment, media star agencies to create “hard egg? I future hardware competition ” was officially launched in Beijing, and formally for the national solicitation of hardware innovations project. At the launching ceremony, participants from the industrial chain point of view, analysis of the hardware innovation breakthroughs and future opportunities. Zhu Jizhi, Executive Vice President of Cogobuy City, said in his speech at the launch that China has a strong lead in hardware manufacturing