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在集成电路的产生过程中,清洗工艺是很重要的.清洗的好坏直接影响生产的成败,所以生产中迫切需要有检测清洗质量的方法.可惜至今没有直接检测清洗后硅片质量的手段.近年来,表面分析技术,特别是SIMS、AES分析技术的进展,促进了这方面的研究,但都没有能达到实用的程度.一些文献中只是报告了不同清洗液、不同清洗工艺清洗后硅片表面洁净度的相对比较,没有达到检出使用同种清洗液、同种清洗工艺的正常生产中,由于操作过程中的微小差异所造成的清洗质量的微小波动.只有检测出这种波动,分析技术
In the production of integrated circuits, the cleaning process is very important.The quality of cleaning directly affects the success or failure of the production, so there is an urgent need for a method of testing the quality of cleaning in production.However, there is no means to directly test the quality of silicon after cleaning. In recent years, the progress of surface analysis technology, especially SIMS and AES analysis technology has promoted the research in this aspect, but none of them can reach the practical level.Recently, some literatures report only different cleaning solutions, different cleaning process wafers Surface cleanliness of the relative comparison did not reach the detection of the same cleaning solution, the same kind of cleaning process in the normal production, due to minor differences in the operation of the cleaning quality caused by minor fluctuations.Only if such fluctuations are detected, analysis technology