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本文主要讨论了焊接缺陷在电子产品SMT(表面组装技术)制造工艺中的成因,以整个SMT制造工艺为研究范畴,通过几个设定的仿真实验,从模板制作、焊膏选择、印刷工序、焊接工序、贴片工序等角度,以一个常见缺陷桥连为研究对象,分析了造成桥连的缺陷成因,研究了解决的办法,评价了各成因因子的危害程度,并以此为基础拓展到其他缺陷,得出SMT生产工艺改进的要点。
This article mainly discusses the cause of the welding defects in SMT (Surface Mount Technology) manufacturing process. Taking the whole SMT manufacturing process as the research area, through several set of simulation experiments, from the template making, solder paste selection, printing process, Welding process and patch process, taking a common defect bridging as the research object, this paper analyzes the causes of the bridging defects, studies the solutions, evaluates the damage degree of each contributing factor, and then expands it to Other defects, come to SMT production process improvement points.