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我国通信产业的快速发展,直接拉动了集成电路市场的广阔需求,手机芯片、宽带网络接入和通信设备终端芯片已成为众多通信专用芯片厂商关注的焦点。近年来,无论国际还是国内在通信产业,半导体产业,都出现了一些新情况,新问题,对通信系统厂商、芯片厂商也提出了新的要求和挑战。针对我国通信产业的现状与特点、第三代(3G)移动通信的发展以及通信专用集成电路的热点、疑点、难点等相关问题,本刊记者走访了通信集成电路领域的有关专家和企业代表,并分别就我国通信集成电路产业的研究内容和发展方向提出了自己建设性的意见。
The rapid development of China’s communications industry has directly driven the broad market demand for integrated circuits. Handset chips, broadband network access and communication equipment terminal chips have become the focus of many communications chip manufacturers. In recent years, new situations and new problems have emerged both in the communications industry and in the semiconductor industry both at home and abroad, posing new requirements and challenges to manufacturers of communication systems and chip makers. In response to the status quo and characteristics of China’s communications industry, the development of the third generation (3G) mobile communications, and the hot spots, doubts and difficulties of communications ASICs, our correspondents visited relevant experts and business representatives in the field of communications integrated circuits, And put forward their own constructive opinions respectively on the research content and development direction of China’s communications integrated circuit industry.