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采用闭合场非平衡磁控溅射离子镀技术在单晶硅(111)衬底上沉积了CrCN镀层以研究C靶电流对镀层显微硬度的影响,并通过X射线衍射、原子力显微镜、X射线光电子能谱和透射电镜对镀层进行了分析。结果表明:当C靶电流由0增加到1.5 A时,镀层显微硬度由1930 HV增加到2300 HV,提高约19%,并且镀层的颗粒明显变小;X射线衍射和透射电镜分析表明,随着C靶电流增大,镀层由晶态向非晶态转变;X射线光电子能谱分析表明,镀层碳元素主要以sp2键、sp3键和C-Cr键的形式存在。
The CrCN coating was deposited on the monocrystalline Si (111) substrate by closed-field unbalanced magnetron sputtering. The effects of C target current on the microhardness of the coating were investigated. The effects of X-ray diffraction, atomic force microscopy, Photoelectron spectroscopy and transmission electron microscopy were analyzed. The results show that when the C target current increases from 0 to 1.5 A, the microhardness of the coatings increases from 1930 HV to 2300 HV, about 19% higher and the grain size of the coating becomes smaller obviously. XRD and TEM analyzes show that The C target current increases and the coating changes from crystalline to amorphous. X-ray photoelectron spectroscopy analysis shows that the carbon in the coating mainly exists in the form of sp2, sp3 and C-Cr bonds.