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采用直流反应溅射技术可以制备出具有光催化作用的TiO2薄膜。这种TiO2薄膜经紫外光辐照后,可以分解有机物以及降低水和TiO2薄膜表面之间的接触角。然而,普通的直流反应溅射在制备介质膜时,普遍都存在着工艺不稳定、沉积速率低的问题,所以它不适合于工业化生产。脉冲磁控溅射与直流磁控溅射相比,它在基体表面附近具有较高的等离子体密度以及带电粒子具有较高的能量,这对于TiO2在低温下结晶十分有利。此外,采用双极脉冲模式生长的TiO2薄膜,它的光催化特性要优于单极脉冲模式。这种双极脉冲溅射并结合等离子体发射监控(PEM),使得工艺稳定性得到了改善,沉积速率亦得到了提高。
TiO2 films with photocatalysis can be prepared by DC reactive sputtering. After being irradiated with ultraviolet light, the TiO2 film can decompose organic matter and reduce the contact angle between water and the surface of the TiO2 film. However, ordinary DC reactive sputtering generally has the problem of unstable process and low deposition rate when preparing the dielectric film, so it is not suitable for industrial production. Compared with DC magnetron sputtering, pulsed magnetron sputtering has higher plasma density near the substrate surface and higher energy of charged particles, which is very beneficial for the crystallization of TiO2 at low temperature. In addition, the TiO2 film grown by bipolar pulsed mode has better photocatalytic properties than the unipolar pulsed mode. This bipolar pulsed sputtering combined with plasma emission monitoring (PEM) results in improved process stability and increased deposition rate.