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为查明熔锥型光纤器件封装材料对器件光学性能的影响,基于弱波导耦合模理论,建立了封装材料折射率与光纤耦合器分光比的数学模型,找到了它们之间的关联规律。以六轴光纤耦合器熔融拉锥机制作耦合器样品,以H2O与NaCl的不同配比实现封装材料折射率的变化,进行了相应的光学实验。实验结果表明:光纤耦合器的分光比对封装材料的折射率很敏感,折射率在一定的范围内,随着封装材料折射率的增大,耦合器分光比增大,并且具有单调性。这为封装材料的选取提供了理论依据与实验指导。
In order to find out the influence of encapsulation material on the optical properties of fused-tapered fiber devices, a mathematic model of the refractive index of the encapsulant and the splitting ratio of the fiber coupler was established based on the theory of weak waveguide coupling modes. The correlation between them was found out. The coupler sample was made by a six-axis fiber coupler fusion taper machine. The refractive index of the encapsulant material was changed by the ratio of H2O and NaCl, and the corresponding optical experiments were carried out. Experimental results show that the splitting ratio of the fiber coupler is sensitive to the refractive index of the encapsulating material and the refractive index is within a certain range. As the refractive index of the encapsulating material increases, the splitting ratio of the coupler increases and it is monotonous. This provides a theoretical basis for the selection of packaging materials and experimental guidance.