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用俄歇电子能谱(AES),电子探针(BPM),扫描电镜(SEM),金相等技术分析了两种工业纯铜。分析结果表明,氧,铅杂质元素在铜内析出的脆性相是造成此类工业纯铜加工脆性的主要原因。
Two types of industrial pure copper were analyzed by Auger electron spectroscopy (AES), electron probe (BPM), scanning electron microscopy (SEM) and gold plating techniques. The analysis results show that the brittle phase precipitated in the copper by oxygen and lead impurity elements is the main reason for the processing brittleness of such industrial pure copper.