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美国Sandia国家实验室与新墨西哥州大学的工程师们经过五年合作,研制成一种可点燃爆炸物的微型器件,称之为半导体桥(SCB),其速度比一般“热线”快一千倍。SCB可代替或扩大小金属桥式导线(热线)的功能,适用于军事、太空和民用等方面小型爆炸物的电点火,而且只需起爆能量的1/10(3mJ)。器件尺寸微小,能极牢固地装在1.5mm~2的芯片内。SCB的高技术性用高精度自动控制技术实现,从而改进了器件的可靠性和稳定性,降低了制造成本。SCB是在蓝宝石或硅衬底上制备高掺杂硅或多晶硅区域制成。采用磷扩散掺杂,器件表面形成一H形图形的横条,以与覆盖在上面的铝岛形成良好接触。Sandia实验室已制成一个直径1.5英寸、装有SCB灵巧的部件样品;另外,还正在设计一个直径小于1英寸的SCB样品。SCB器件的典型尺寸为:100×380×2μm,铝岛层厚约1μm。
After five years working together, engineers at Sandia National Laboratory and the University of New Mexico in the United States developed a tiny device called an explosible bridge called a semiconductor bridge (SCB) that is a thousand times faster than a normal “hotline.” SCB can replace or expand the function of small metal bridge wire (hot wire), suitable for electric ignition of small explosives such as military, space and civil, and only need to detonate energy 1/10 (3mJ). Device size is small, can be very firmly mounted in 1.5mm ~ 2 chip. SCB high-tech high-precision automatic control technology to achieve, thereby improving the reliability and stability of the device, reducing manufacturing costs. SCB is made of highly doped silicon or polysilicon regions on sapphire or silicon substrates. Using phosphorus diffusion doping, the device surface is formed with an H-shaped pattern of stripes to make good contact with the covered aluminum islands. Sandia Laboratories has produced a sample of 1.5-in. Diameter parts with SCB dexterity and is also designing a SCB sample less than 1 inch in diameter. The typical size of an SCB device is 100 × 380 × 2 μm and the thickness of the aluminum island is about 1 μm.