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使用G/Epoxy作为底材研究了垫板、结构胶黏剂厚度和底材表面处理对拉伸剪切强度的影响。使用光学显微镜观察了断口形貌。结果表明加垫板能减小试验过程中由于加载偏心引起剥离应力,测试结果较大;结构胶黏剂的厚度和底材表面处理对拉伸剪切强度影响十分明显,随着厚度的增大而减小,经打磨表面裸露出纤维的试样拉伸剪切强度很低。结构胶黏剂厚度较小时以内聚破坏为主,随着厚度的增加破坏模式转变为粘接破坏。
Using G / Epoxy as a substrate, the effects of the thickness of the backing plate, the structural adhesive and the surface treatment of the substrate on the tensile shear strength were studied. The fracture morphology was observed using an optical microscope. The results show that the backing plate can reduce the peel stress caused by loading eccentricity during the test, and the test results are larger. The thickness of the structural adhesive and the effect of the substrate surface treatment on the tensile shear strength are very obvious. With the increase of the thickness On the other hand, the tensile shear strength of the specimens exposed by the polished surface is very low. When the thickness of the structural adhesive is small, the cohesive failure is dominant, and the failure mode changes to the adhesive failure as the thickness increases.