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本文观察了采用纯Cu箔的Al2O3p/Al复合材料液相扩散焊接头外观成形与断口特征发现:对接处周边存在一定的溶蚀与流失;断口上Al2O3颗粒既未破裂,也无粘结物生成,表面呈光滑状。断口特征表明,陶瓷颗粒/金属(P/M)界面结合弱而呈界面脱粘断裂方式(debonding fracture mode)。为此,提出了一种旨在改善P/M弱界面润湿性的新工艺——活性液相扩散焊,要求其所用中间层内必须同时含有降熔元素及可与陶瓷增强相反应的活性元素;研究了Ti的添加及含量对P/M弱界面的强化效果。所设计的Cu-(1～10wt.%)Ti系中间层在600℃均被顺利液化,并使Ti可以顺利地与Al2O3颗粒增强相反应;Ti的添加可以缩短液相流失距离;特别是避免了承载时P/M界面出现界面脱粘的断裂模式。当Ti的含量较低时,Al2O3颗粒增强相表面上出现细微、凹凸不平且不连续的界面粘结物(反应物);当Ti的含量较高时,P/M界面可形成强力结合,剪切测试中足以使一些陶瓷颗粒本身破裂,但Ti的过量添加会引起基体脆化,焊接面周边的环状缺口窄而深。
In this paper, we observed the formation and fracture of Al2O3p / Al composites by pure Cu foil. The appearance and fracture of Al2O3p / Al composites show that there is some corrosion and loss around the junction. The Al2O3 particles on the fracture surface are neither broken nor bonded, The surface is smooth. Fracture characteristics indicate that the ceramic / metal (P / M) interface is weak and debonding fracture mode. Therefore, a new technology, reactive liquid phase diffusion welding, is proposed to improve the wettability of P / M weak interface. It is required that the intermediate layer used in the process should contain both antifusing elements and activity that can react with the ceramic reinforcing phase Element; strengthening effect of Ti addition and content on P / M weak interface was studied. The designed Ti-based intermediate layer of Cu- (1 ~ 10wt.%) Is smoothly liquefied at 600 ℃, and Ti can smoothly react with the Al2O3 particles. The addition of Ti can shorten the liquid loss distance; in particular, it can avoid The load-bearing P / M interface interface debonding fracture mode. When the content of Ti is low, fine, irregular and discontinuous interfacial bond (reactant) appears on the surface of Al2O3 particle reinforced phase. When Ti content is high, the P / M interface can form strong bond and shear Cutting test is sufficient to break some of the ceramic particles themselves, but the excessive Ti addition will cause the embrittlement of the matrix, narrow and deep annular notch around the weld surface.