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简介近来,安装 IC 芯片的印制线路板基本上分为两类:即陶瓷基印制板和塑料基印制板。陶瓷基印制板,在可靠性方面的低热膨胀和高弹性模量,性能是优异的;但在成本、可加工性和布线性能方面显得较差。反之,塑料基印制板在可加工性、多层加工性和布线方面性能是优异的,但在吸湿性、耐热性和可靠性方面较差。现在开发的基材,兼备陶瓷基材和塑料基材两者的优良特性。使用特有的界面控制技术,往树脂中加入大量的无机填料,这在通常是不可能做到的。该基材具有低热膨胀和高弹性模量的性能。在 Z 方向(hickness,厚度方向)
INTRODUCTION Recently, printed circuit boards with IC chips are basically divided into two categories: ceramic-based printed boards and plastic-based printed boards. The ceramic-based printed board, which has low thermal expansion and high modulus of elasticity in terms of reliability, is superior in performance but inferior in cost, workability and wiring performance. In contrast, plastic-based printed boards are superior in workability, multi-layer processability and wiring performance but poor in hygroscopicity, heat resistance and reliability. Now developed substrate, both ceramic substrate and plastic substrate excellent characteristics of both. Using proprietary interface control techniques, adding a large amount of inorganic filler to the resin is generally not possible. The substrate has low thermal expansion and high modulus of elasticity properties. In the Z direction (hickness, thickness direction)