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介绍了一种简单有效的微力、微位移天平测试方法,通过对薄型硅悬臂梁进行力—挠度特性测试进而提取材料杨氏模量的方法是简便、可行的。还介绍了用于测量薄膜应力的悬臂梁挠曲法,对于硅上热生长1.1μm SiO_2的结构,测得SiO_2膜内的压应力为200～230MPa.微力微位移天平测试方法操作方便,仪器成本低,具有较高精度。
A simple and effective micromechanical and micro displacement scale test method is introduced. The method of extracting the Young’s modulus of the thin silicon cantilever by force-deflection test is simple and feasible. Also introduced is the cantilever deflection method used to measure the film stress. For the structure of 1.1μm SiO_2 thermally grown on silicon, the compressive stress in the SiO_2 film is 200 ~ 230MPa.The micro-force displacement scale test method is easy to operate and the instrument cost Low, with high accuracy.