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为了满足工业、航天、国防等领域对微型化压力传感器的需求,提出了基于微机电系统(MEMS,Micro electromechanical System)技术制作的非本征型光纤法布里-珀罗(F-P)压力传感器,该传感器传感头由全玻璃材料构成。主要研究了MEMS技术制作全玻璃结构式压力传感器工艺,结合溅射、光刻、腐蚀等工艺在7740wafer基底上制作出F-P腔体,利用低压化学气相沉积(LPCVD)的方法在基底上沉积一层40nm的非晶硅作为中间层。通过阳极键合技术在温度400℃下完成玻璃与玻璃的键合,并搭建了该传感器的压力测量平台。实验结果表明:在压力线性范围0~400kPa内传感器具有很高的重复性,达到0.3%。灵敏度达到1.764 nm/kPa;在传感器使用范围0~80℃内,热敏感系数为0.15 nm/℃。该传感器的研究对设计制作改善了该类传感器的热膨胀失配问题,对低温漂型压力传感器的研究有一定参考价值。
In order to meet the demand for miniaturized pressure sensors in the fields of industry, spaceflight and national defense, an extrinsic fiber Fabry-Perot (FP) pressure sensor based on micro-electromechanical system (MEMS) The sensor head is made of all-glass material. The main work of this paper is to study MEMS fabrication technology of all-glass pressure sensor. Fabrication of FP cavity on 7740wafer substrate by sputtering, photolithography and etching is carried out. A 40 nm layer of 40 nm film is deposited on the substrate by low pressure chemical vapor deposition (LPCVD) Of amorphous silicon as an intermediate layer. The bonding between glass and glass was completed by anodic bonding technology at a temperature of 400 ℃, and the pressure measurement platform of the sensor was built. The experimental results show that the sensor has a high repeatability of 0.3% in the linear pressure range of 0 ~ 400kPa. Sensitivity of 1.764 nm / kPa; in the use of the sensor 0 ~ 80 ℃, the thermal sensitivity coefficient of 0.15 nm / ℃. The research of this sensor has improved the thermal expansion mismatch of this kind of sensor to design and make some reference value for the research of low temperature drift type pressure sensor.