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2002年半导体产业出现大幅下滑,芯片封装市场也遭受沉重打击。但根据 Frost &Sullivan 公司的预测,这一市场将逐步恢复,并有望在未来6年内增长43.3%。Frost & Sullivan 公司表示,尽管 BGA、CSP、SOP 等封装市场2002年都出现下滑,但这一市场将迅速恢复增长。根据 Frost &Su llivan 的数字,全球高端芯片封装市场将从2001年的66.1亿美元增长到2007年的116.5亿美元。Frost & Sullivan 公司指出,尽管该市场肯定会恢复增长,但芯片封装、装配和测试工厂也面临很多挑战。除了现在的产业低迷外,这些厂商还不得不面对价格压力和新的竞争
In 2002 the semiconductor industry showed a sharp decline, the chip packaging market has also suffered a heavy blow. However, according to Frost & Sullivan’s forecast, the market will gradually recover and is expected to grow by 43.3% over the next six years. Frost & Sullivan said that although packaging markets such as BGA, CSP, SOP and others have all declined in 2002, the market will recover rapidly. According to Frost & Sullivan, the global market for high-end chip packages will grow from 6.61 billion U.S. dollars in 2001 to 11.65 billion U.S. dollars in 2007. Frost & Sullivan notes that while the market is set to regain growth, chip packaging, assembly and test facilities are also faced with many challenges. In addition to the current downturn in the industry, these companies also have to face price pressures and new competition