加工多类型晶圆的集束型装备调度模型

来源 :数学的实践与认识 | 被引量 : 0次 | 上传用户:huiz_CSU
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研究了加工多类型晶圆和有滞留时间约束的集束型装备调度问题,其中包括晶圆排序和双臂机械手搬运作业排序两类问题.分别推导了三类不等式约束条件,包括加工模块处于加工和空闲两种状态下的滞留时间约束、任意单个和两个搬运作业情况下的机械手搬运能力约束,以及加工模块能力约束,建立了以最小化生产周期为目标的混合整数规划模型.典型生产实例和随机算例的仿真结果验证了模型的可行性和有效性. The scheduling problem of multi-type wafers and the restrained cluster equipment with constraints of dwell time are studied, including two sorts of problems, such as wafer sorting and dual-arm manipulator handling, and three types of inequality constraints are derived respectively, including processing module The idle time constraints of the two states, any single and two handling operations under the robot handling capacity constraints, and processing module capacity constraints, to minimize the production cycle to establish a mixed integer programming model for the typical production examples and The simulation results of the random example verify the feasibility and effectiveness of the model.
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