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近10年来甲基磺酸已广泛替代氟硼酸应用于电子设备表面锡焊电沉积领域,其它一些涉及铅的电化学工艺,如贝特工艺电解精炼铅等,目前多采用氟硅酸体系电解液。由于甲基磺酸(MSA)体系电解液在环保方面具有明显优势,越来越多以MSA替代现有电解液方面的研究。另外,市场上部分钢板镀锡工艺也转向采用甲基磺酸镀锡电解液。此外,在镀银、镀镍、镀铜、镀镉及镀锌等领域,MSA的应用市场也在不断发展。本文介绍了甲基磺酸的化学、物理特性,及其在金属精饰方面的应用和优势。
Methanesulfonic acid has been extensively substituted for fluoroboric acid in the past 10 years in the field of soldering electrodeposition of electronic devices. Some other electrochemical processes involving lead, such as lead in electrolytic process, . Due to the obvious environmental advantages of methylsulfonic acid (MSA) system electrolytes, more and more researches on the replacement of existing electrolytes with MSA have been made. In addition, the market part of the plate tin plating process also turned to tin sulfonic acid electrolyte. In addition, MSA applications are also evolving in the areas of silver plating, nickel plating, copper plating, cadmium plating and zinc plating. This article describes the chemical, physical properties of methanesulfonic acid, and its application and advantages in metal finishing.