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文中提出将纳米银焊膏与纳米铜焊膏按照一定比例进行混合,研究其烧结特性及其用于低温烧结连接镀银的铜块.结果表明,多元醇法制得的纳米银+纳米铜混合焊膏具有良好的防氧化特性;在5 MPa压力并保温5 min条件下,摩尔比例为1∶1的混合焊膏在烧结温度为250℃时,接头抗剪强度最大并达到22 MPa.随混合焊膏中纳米银颗粒含量增加,接头强度逐渐增大;纯纳米铜颗粒焊膏的接头抗剪强度为15 MPa,纯纳米银焊膏的接头强度可到达56 MPa.
In this paper, nano-silver solder paste and nano-copper solder paste are mixed according to a certain proportion, and its sintering characteristics and its application to low-temperature sintering of silver-plated copper block are studied.The results show that the nano-silver + The paste has a good anti-oxidation properties; 5MPa pressure and incubated for 5 min, the molar ratio of 1: 1 at a sintering temperature of 250 ℃, the joint shear strength up to 22 MPa. With the hybrid welding The content of nano-silver particles in the paste increased and the strength of the joint increased gradually. The shearing strength of pure nano-copper particle solder paste joint was 15 MPa, and the joint strength of pure nano-silver paste reached 56 MPa.