选用硼改性酚醛树脂为基体,固体羧基丁腈混炼胶为增韧剂,硼粉、硅粉、碳化硼(B4C)为填料,制备了酚醛胶粘剂。通过粘接强度测试和热重分析研究了丁腈混炼胶用量,硼粉、硅粉、B4C的粒径对硼酚醛胶粘剂性能的影响。结果表明:当固体羧基丁腈混炼胶的质量分数为12%时,其室温粘接强度达到最大值。硼粉,硅粉和碳化硼的最佳粒径分别为20,13,3.5μm,所制备的硼酚醛胶粘剂对不同材料都有较好的高温粘接性能,其使用温度可以达到800℃以上。 Phenolic adhesive was prepared by using boron modified phenolic resin as matrix and solid carboxyl butyronitrile as toughening agent, boron powder, silicon powder and boron carbide (B4C) as filler. The effects of the amount of NBR, boron powder, silica fume and the particle size of B4C on the properties of boron-phenolic adhesives were studied by means of adhesive strength test and thermogravimetric analysis. The results show that when the mass ratio of solid carboxylated butyronitrile is 12%, the adhesive strength reaches the maximum at room temperature. The optimum particle sizes of boron powder, silicon powder and boron carbide are 20, 13, and 3.5μm, respectively. The prepared boron-phenolic adhesives have good high-temperature adhesion properties to different materials and can be used at temperatures above 800 ° C.